Cadence Giving Foundation Awards 25 First-Generation Scholarships
Congratulations to the recipients of the 2025-2026 Cadence First-Generation Student Scholarship! As we look toward the future of innovation and the technology industry, it's essential for the next...
View ArticleInsights from the Verification Software Track at CadenceLIVE Silicon Valley 2025
Earlier this month, I had the opportunity to attend CadenceLIVE Silicon Valley 2025 , a premier event that brings together semiconductor and systems innovators to share how they are leveraging Cadence...
View ArticleTime-of-Flight Decoding with Tensilica Vision DSPs - AI's Role in ToF Decoding
In our previous blog, we discussed the fundamentals of time-of-flight (ToF) technology, including the signal processing requirements for pre-processing and decoding ToF sensor data. We also examined...
View ArticleTransforming Chip Design with Cadence Cerebrus AI Studio
Cadence is transforming chip design with the launch of Cadence Cerebrus ® AI Studio, the industry's first agentic AI, multi-block, multi-user design platform. This cutting-edge solution accelerates...
View ArticleDriving the Future of High-Speed Computing with PCIe 7.0 Innovation
Escalating compute processing demands from generative and agentic AI applications have spurred a massive AI infrastructure buildout, and the need for faster and more efficient data transfer...
View ArticleDiscover Cadence Community Forums Resources for Tcl Scripting
In the world of PCB design and IC packaging, automation is key to enhancing productivity and ensuring precision. Allegro X tools from Cadence offer extensive scripting capabilities through Tcl (Tool...
View ArticleElevate Your EDA Skills: Achieve Unmatched PPA with Genus Synthesis Solution
As the electronic design automation (EDA) landscape continues to evolve, the importance of efficient and effective synthesis has grown exponentially. With the increasing complexity of modern...
View ArticleAnalog and Digital IC Design Flows: The Past, Present, and Future of Electronics
This post has been authored by Salagrama Vishnu Teja and Pamula Sai Srinivas In the ever-evolving world of technology, Integrated Circuits (ICs) are the unsung heroes. From the smartphone in your...
View ArticleCadence Leads the Way at PCI-SIG DevCon 2025 with Groundbreaking PCIe 7.0 Demos
As we move through 2025, the momentum generated by Cadence continues to energize the PCIe ecosystem. At the 2025 PCI-SIG Developer's Conference in Santa Clara, CA, Cadence delivered a commanding...
View ArticleAccelerating Innovation: The SolarCar at Virginia Tech Team
At a time when sustainability and innovation are beautifully coming together, the SolarCar at Virginia Tech team shines brightly as a testament to the power of collaboration, engineering talent, and a...
View ArticleCadence Customers Share Experiences with Revolutionary PCB Design Methodology
PCB design teams are often caught in a repetitive cycle of design and simulation with multiple iterations to meet PCB design constraints. At CadenceLIVE Silicon Valley 2025, Cadence customers Priya...
View ArticleEmpowering RF Power: Must-See Video Series for AWR Users!
Calling all AWR Microwave and RF designers—getting the most out of your tools just got easier (and faster)! We’re thrilled to launch a 3-part video web series for Cadence AWR Microwave/RF Design...
View ArticleCadence UCIe IP 在 Samsung Foundry 的 5nm 汽车工艺上实现流片成功
我们很高兴能在此宣布，Cadence 基于UCIe ™ 标准封装 IP 已在 Samsung Foundry 的 5nm 汽车工艺上实现首次流片成功。这一里程碑彰显了我们持续提供高性能车规级IP解决方案的承诺，可满足新一代汽车电子和高性能计算应用的严格要求。 Cadence的UCle IP在 16GT/s 的最高速率及所有支持的更低速率下均实现全功能运行，其眼图质量和误码率...
View ArticleCadence Welcomes VLAB Works
Cadence welcomes VLAB Works, a division of Australian Semiconductor Technology Corporation (ASTC) and a renowned leader in virtual platforms. The VLAB Works team provides an ultra-high-performance...
View ArticleCadence Launches Cache-Coherent HiFi 5s SMP for Next-Gen Audio Applications
Next-generation consumer and automotive audio is becoming increasingly sophisticated, and market drivers such as generative AI-based audio processing, immersive soundscapes, and advanced infotainment...
View ArticleEnkl Sound 利用 Tensilica HiFi DSP 优化音频技术，缔造无与伦比的卓越音质
在快速发展的音频技术领域， Enkl Sound Copenhagen 宛如一座创新的灯塔，将经典斯堪的纳维亚设计与前沿数字声音处理技术相融合，而促成这种融合的核心，便是与同样对卓越音质和节能设计有着共同追求的 Cadence 的合作。此次合作旨在提升 Enkl Sound 蓝牙音箱的音质，让日常聆听成为一场超凡的听觉盛宴。Enkl Sound 将丹麦美学原理的精髓与 Tensilica HiFi...
View ArticleRedefining SoC Design: The Shift to Secure Chiplet-Based Architectures
The semiconductor industry is undergoing a paradigm shift from monolithic system-on-chip (SoC) architectures to modular, chiplet-based designs. This transformation is driven by escalating design...
View ArticlePCB Design Workflow Using Sigrity X for Signal and Power Integrity Analysis
Jasmine Vital Muniz, Electrical Engineer, OLogic, Inc. While many electronic design companies can standardize on a single vendor workflow for PCB design, not all can. OLogic, Inc. , a Silicon Valley...
View Article瑞芯微 RK2118 集成 Cadence Tensilica HiFi 4 DSP 提供强大的音频处理
搭载 Cadence Tensilica HiFi 4 DSP的 Rockchip RK2118 系统级芯片（SoC）已于 2024 年第四季度投入量产。这款尖端的 SoC 有望利用 HiFi 4 DSP 及其广泛生态系统的强大功能，有效提升汽车音响系统及传统消费电子音频产品性能及体验。 RK2118 集成了 Cadence 的 Tensilica HiFi 4 DSP。之所以选择 HiFi...
View ArticleGenAI-Powered ASK AI Assistant Now Live on Cadence ASK Portal
You might remember the blog about the GenAI Feature on Cadence ASK that we published a couple of months ago. Today, we would like to share some more exciting news as our enhanced AI Assistant is now...
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