Via structures—those reusable patterns of conductor clines and vias designers rely on to maximize their productivity—have a long-standing place in the robust escape routing feature set in the Cadence IC Packaging Tools. Many of us use only the basic capabilities in the via structures repertoire, though, to create structures in the current drawing and replicate them across a pattern of pins. Today, we'll look beyond those basics to see how a crafty package designer can really save...(read more)![]()
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