Given that CES is a novelty-focused event, it is crucial that innovative companies such as Cadence use this opportunity to demonstrate the technology behind the latest consumer gadgets. This year, however, we’re taking everything a step further. During CES 2015, not only will we present our individual products but also complete systems solutions that integrate Cadence ® Tensilica ® IP ( TIP ) with Design IP ( DIP ). Why are we putting so much focus on systems solutions this year? You, as our customer, want to speed up your time-to-market and our goal is to help you make it happen by offering a very short duty cycle time. But nowadays, is it still enough? Not exactly. What you really want is 2 in 1. Fast time-to-market and a complete, integrated solution. And that’s the reason why our broad portfolio to address the consumer market has become so essential. We have observed increasing interest in the TIP/DIP combination, especially from mobile manufacturers. The mobile is one of the key areas where Cadence has been successful, with our IP being used by several top mobile manufacturers. And when you think of mobile, you think MIPI ® . Which brings us to the IVP and MIPI demo you will see at CES 2015. What’s the real value behind the IVP and MIPI demo? The demonstration will show a system solution that integrates MIPI controllers with a Tensilica IVP processor. On the TIP side you get the new image and video processing capability, while on the DIP side you’ll see MIPI CSI (camera) and DSI (display) controllers combined with MIPI D-PHY , implemented on the TSMC 28HPM process. It’s a complete, end-to-end system. The image is captured on the MIPI CMOS sensor, then a video is shot and processed by the IVP processor, with the final result shown on the MIPI display. We will present the face detection algorithm, one of multiple DSI algorithms that the IVP processor can run. As you will see, the demonstration provides you with a working system example of how such tools can be utilized for mobile, IoT, or infotainment systems. In what other ways will Cadence be present at CES 2015? The IVP and MIPI demo is only one of several Cadence exhibits that are going to be shown at CES. There will be a Cadence booth, dedicated meeting rooms, and several other system demonstrations presented by us and our customers. Numerous Cadence representatives will attend, so we will be there in force, including Lip-Bu Tan (Cadence president and CEO), Martin Lund (senior vice president for the IP group), and Chris Rowen (CTO for the IP group). Cadence marketing, sales, application engineers, and R&D team members will be there to engage with our select customers. The demonstration and meeting rooms are by invitation only, so make sure to contact your Cadence representative as soon as you read this post!![]()
![]()
↧