Remove Die Stack Layers from NC Drill Outputs using Cadence 16.6 SiP and APD IC Packaging Tools

As we continue with our series on improvements to the manufacturing and documentation outputs in the Cadence 16.6 IC Packaging layout tools, our focus this week is on NC Drill outputs. For as long as NC Drill data has been a part of the IC Packaging tools, and the cross-sections in package designs have had die stack (die in APD) layers, NC outputs have included these layers in their outputs. This means that the first layer of the actual package substrate would not be layer 1 in the NC drill data...(read more)