As we all know, there are many file formats in which an IC package designer will receive a die from the IC designer. Ideally, it will be in a format such as die text or a co-design die abstract, as these files contain both logical and physical information in a single, comprehensive file. Reality is often not that easy, though; in many situations, you may receive a GDSII or DXF file containing the die outline, pins, and (if you're lucky) signal names. In these cases, the die component needs to...(read more)![]()
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