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See the Differences Between Your Designs Visually with the Layer Compare Toolset in 16.6 APD and SiP Layout Tools

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Have you ever wondered exactly what has changed between two different versions of a package substrate? Perhaps you've wanted to see exactly what metal on the top surface of your package is exposed through the combination of solder mask openings and etch-back mask areas. Or, it could be that a metal density analysis across two layers shows significant differences and you want to see all the areas where only one of the layers has metal, so you can add metal in the ideal regions to achieve proper...(read more)

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