Clik here to view.
“Like” Cadence on Facebook in 2014!
I've been blogging for Cadence for nearly five years now, and I also use Twitter (@RichardGoering) and live blogging. Until recently, however, I was unconvinced that Facebook would become a popular...
View ArticleClik here to view.
Encounter® RTL Compiler Hierarchical ILM (Interface Logic Model) Flow
How to use Encounter® RTL Compiler support Interface Logic Models during synthesis. ...(read more)
View ArticleClik here to view.
New Capabilities in the C-to-Silicon Compiler 2013 Releases
2013 was a banner year for high-level synthesis and C-to-Silicon Compiler in particular. We saw our customers take on over 75 new projects using C-to-Silicon, much of that coming from expanded adoption...
View ArticleClik here to view.
Customer Support Recommended - Implementing Jumpers in Allegro PCB Editor
Over the time, jumpers have found their importance in multiple applications. The following blog is aimed to provide more insight on their usage and implementation using Cadence Allegro PCB Editor.What...
View ArticleClik here to view.
Get Your Signal Integrity Update at DesignCon 2014
With a theme of "where the chip meets the board," DesignCon is the premier technical conference dedicated to signal integrity at the chip, board, and system levels. Produced by UBM Tech, DesignCon 2014...
View ArticleClik here to view.
What's Good About AMS Multi-Core Engine Support? It’s in the 16.6 Release!
The 16.6 AMS Simulator (PSpice) release now includes support for multi-core capabilities. There are several runtime options available to enhance the performance of simulation runs.Read on for more...
View ArticleClik here to view.
Cadence at CES 2014: Live Blog, Tensilica IP Demos, and More
A solar-powered car (right). An ultra-HD 3D wall. Smart light bulbs. A massage chair. A wristband for sports and wellness apps. A private drone that flies and records HD video...where can you see all...
View ArticleClik here to view.
Five-Minute Tutorial: Start the New Year with Voltus Timing Signoff Tool
Happy New Year to all of our Digital Implementation Blog readers - and also to anyone new who is stopping by to check us out. We're glad you're here and we hope you'll hang out with us for a while! I...
View ArticleClik here to view.
CES 2014: Past Is Prologue for Electronics Design
We are tempted to view the annual Consumer Electronics Show as a peek at electronics design's future. It's not. It's a view into the past, since the systems on display at CES 2014 in Las Vegas had...
View ArticleClik here to view.
CES 2014 in Review; Chips are Down; GloFo's New CEO (Great Reads 1-10-2014)
[<a href="//storify.com/bfuller9/xxxx-great-reads-1-10-2104"...
View ArticleClik here to view.
Incisive 13.2 – Verification Apps Use Formal Methods to Boost Productivity
The Cadence Incisive 13.2 announcement, made today (Jan. 13, 2014), brings unparalleled performance to IC functional verification. But the complete message is not about how fast a simulator can run -...
View ArticleClik here to view.
New Rapid Adoption Kit on Encounter RTL Compiler: RC-Physical Low Power Flow
Cadence's Digital Front-End Design Team first introduced the concept of a Rapid Adoption Kit (RAK) , self-guided and learn-by-doing training material, over two and a half years ago, helping its users...
View ArticleClik here to view.
Electronics Outlook 2014: New Paradigm Takes Hold?
There's an old saying: Forecasting an electronics outlook is like trying to drive a car blindfolded and following directions given by a person who is looking out the back window.Still, that's never...
View ArticleClik here to view.
Recap of Another Successful Japan C-to-Silicon User Seminar
Back in November, our Japan office hosted a C-to-Silicon Compiler user meeting. They host about two per year, and the meetings have been growing in size and content. The November session drew 44...
View ArticleClik here to view.
See the Differences Between Your Designs Visually with the Layer Compare...
Have you ever wondered exactly what has changed between two different versions of a package substrate? Perhaps you've wanted to see exactly what metal on the top surface of your package is exposed...
View ArticleClik here to view.
ST Microelectronics Success with IEEE 1801 / UPF Incisive Simulation - Video
ST Microelectronics reported their success with IEEE 1801 / UPF low-power simulation using Incisive Enterprise Simulator at CDNLive India in November 2013. We were able to meet with Mohit Jain just...
View ArticleClik here to view.
Semiconductor Industry Outlook Continues to Brighten
Earlier this week I tried to read the tea leaves to see how 2014 might shape up for the global semiconductor industry. Since then, some other data points have percolated up that suggest even more...
View ArticleClik here to view.
Freescale Success Stepping Up to Low-Power Verification - Video
Freescale was a successful Incisive® simulation CPF low-power user when they decided to step up their game. In November 2013, at CDNLive India, they presented a paper explaining how they improved their...
View ArticleClik here to view.
Surging EDA, Semiconductor Sales; Google-Nest Implications (Week in Review...
[<a href="//storify.com/bfuller9/semiconductor-sales-surge-google-buys-nest"...
View ArticleClik here to view.
ADI Success Verifying SoC Reset Using X-Propagation Technology - Video
Analog Devices Inc. succeeded in both speeding up the simulation and debug productivity for verifying SoC reset. In November 2013 at CDNLive India they presented a paper detailnig the new technology...
View Article