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Webinar: Addressing MCU Mixed-Signal Design Challenges

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We know IC and system design is changing before our eyes. Not too many years ago, 80 percent of a design started from the ground up while 20 percent was leveraged or re-used from previous projects. Today, those numbers are inverted.

The rise of cores- and platform-based design has helped drive this transformation.

But in an era in which we're taking these productivity gains and pushing more and more analog and mixed-signal technologies into our SoCs, how easy is it? Turns out, it's not as daunting as you might think.

Diya Soubra, CPU Product Marketing Manager, and Joel Rosenberg, Platform Marketing Director (both from ARM), and Cadence Engineering Director Mladen Nizic offered a detailed look at the evolution of MCU mixed-signal design challenges and today's implementation and verification environments in a recent webinar. Click here to watch

Brian Fuller

Related stories:

ARM TechCon Panel: Embedded Software Development Goes from Isolation to Collaboration

IEEE Panel Charts "Top SoC Design Challenges"

 


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