IC Packagers: Guiding Your Team with Workflows
The flow for efficiently and correctly designing a package substrate layout is a complex task. Many teams define steps to be followed by designers to make sure that rules and requirements are...
View ArticleIC Packagers: Routing Clean-Up Prior to Manufacturing
It’s my last blog post of 2019. A fantastic year is ending, so I want to take a quick opportunity to go over some of the lesser-known commands available to you for cleaning up and optimizing your... [[...
View ArticleIC Packagers: Stepping into 2020
We started 2019 with the promise to cover all the topics that might interest you as we go, looking at a new area every week. To keep this promise we had a whole lot of exciting tasks. To start with......
View ArticleThe Year That Was: PCB Design Blogs in 2019
It's the time to take stock of the year gone by and to plan for the year to come. The past year was a busy one for us fulfilling our resolution to be with you every week with a new post in a... [[...
View Article2019: The Year That Was...And Some Surprising News
The biggest happening in 2019 for India was, of course, the general elections. (Though some may argue that it was the ICC Cricket World Cup, which happens every four years!). While uncertainty and......
View ArticleThe History of Lithography, Part 1: From Stones to Lasers
Lithography was originally a way of printing using a flat stone. Lithos (or λίθος) is the Greek for stone. The stone would be coated with wax, then a drawing made in the wax with some sort of...
View ArticleThe History of Lithography, Part 2: From Double-Patterning to EUV
This is a continuation of yesterday's post The History of Lithography, Part 1: From Stones to Lasers . I'm going to drop in a copy of Lars Liebmann's Rosetta Stone of Lithography so you... [[ Click on...
View ArticleProtium and Palladium 1st=
We just finished 2019, of course, so it is time for annual "Best of 2019" lists. Over at John Cooley's DeepChip there was a tie at #1...between the Protium X1 platform and the Palladium... [[ Click on...
View ArticleOpen Source in 2020
I recently wrote a couple of posts about open-source EDA tools, OpenROAD: Open-Source EDA from RTL to GDSII and 2nd WOSET Workshop on Open-Source EDA . I have also written about open-source in... [[...
View ArticleBoardSurfers: PCB Electronics—Six Tasks to Prepare Board for Manufacturing
You have placed components and routed the board . You are finally ready to send the design to a fabrication house to be manufactured. But wait, you have to perform a few tasks yet. You will start... [[...
View ArticleIC Packagers: Four Reasons to Avoid Multi-Layer Flip-Chip Pin Padstacks
Welcome to 2020, everyone! Happy New Year! With the start of a new year, many of us make goals to improve on things we think we can be better at. Whether it’s cutting back on sweet desserts (I... [[...
View ArticleThe 40th Anniversary of LAMBDA Magazine
Forty years ago today, January 8, 1980, the first issue of LAMBDA magazine was published. The Mead & Conway revolution was getting underway. Doug Fairbairn was at Xerox PARC with Lynn Conway. He......
View ArticleWhat's New in Consumer Electronics? CES 2020
I come to Las Vegas in the first week of January each year to attend what used to be called the Consumer Electronics Show but now is officially just its initials CES. Over 175,000 attendees are... [[...
View ArticleThe Rosetta Stone and the British Museum
In the first week of January, I wrote about Lars Liebmann's Rosetta Stone of Lithography in two posts The History of Lithography, Part 1: From Stones to Lasers and The History of Lithography,... [[...
View ArticleSunday Brunch Video for 12th January 2020
https://youtu.be/y62D4tVK-_k Made at CES 2020 (camera Gerard Andrews) Last Thursday: The History of Lithography, Part 1: From Stones to Lasers Last Friday: The History of Lithography, Part 2: From......
View ArticleDetails of TSMC's IEDM Presentation on N5
At IEDM in December, one of the papers in the very last session (a sneaky trick to get us all to stay) was TSMC announcing their 5nm process. The paper actually had the cumbersome title 5nm CMOS... [[...
View ArticleMark Cuban on Media and AI
At CES there was a session in which Mark Cuban was interviewed. As he pointed out, he used to be most famous for being an entrepreneur, and then it was because he was the owner of the Mavericks... [[...
View ArticleIC Packagers: The Default Bond Wire Profile - PROFILE1 (And Three Reasons Why...
For those of you who do wire-bond package substrate – whether you’re designing a single-chip leadframe, a multi-die memory stack, or a complex stack with wire-bonds, flip-chips, interposers, and... [[...
View ArticleBoardSurfers: DFF - Three Steps to Perfect Mask Defined Padstacks in Your PCB
In an earlier blog , we had talked about design for manufacturability (DFM) and discussed how the DesignTrue DFM feature of Allegro® PCB Editor provides a cost-effective and timely solution to... [[...
View Article5G in 2020
There is a famous quote, attributed to Mark Twain but more likely said by his friend Charles Dudley Warner: Everybody talks about the weather but nobody does anything about it. I think that 5G in... [[...
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